Plastic and Ceramic IC Package Inventory

Global Chip Materials offers an extensive inventory of industry standard plastic and ceramic packaging for microelectronic assembly. Cost-effective and reliable, NTK and Kyocera ceramic packages are on-shelf in hundreds of popular sizes and configurations. We now offer the same benefits in our new line of Pre-Molded Open Cavity Plastic Packages. Select from the links below to review product data and submit a RFQ.

Ceramic Package Inventory

Ceramic Side Braze / DIP


Ceramic Leadless Chip Carrier LCC


Ceramic Leaded Chip Carrier CQFJ


Ceramic Pin Grid Array


Ceramic Quad Flat Package / Cerquad CQFP


Ceramic SOIC

Open Cavity Plastic Package Inventory

Plastic Open Cavity


Plastic Open Cavity PLCC


Plastic Open Cavity


Plastic Open Cavity
QFN (Quad Flat No-Lead)

Lids and Covers

Metal Combo Lids


Ceramic Lids — Glass / Epoxy

Global Chip Materials • • Phone 916.853.9300 • Fax 916.853.1274

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