Pre-molded PLCC Package

Global Chip Materials manufactures open cavity PLCC packages in two popular lead counts — 44 and 68. Pre-molded Plastic Leaded Chip Carriers are an ideal, cost-effective solution for quick turn test and prototyping of new IC designs. Open Cavity packages are also ideal for applications such as vision packaging and MEMs. Pre-molded PLCC packages are a lower cost alternative to more expensive ceramic leaded chip carriers. The gold plated lead frame features J-shaped leads that tuck under the package body. Pad sizes are available to accommodate larger die. These packages have JEDEC compliant outlines and can be used with standard PLCC test sockets. They can be easily sealed using epoxy-coated lids or glob top.

More Info On Pre-molded Packages

PLCC Package Configuration Options (Dimensions in inches)

BODY SIZE	LEAD COUNT	LEAD PITCH	DIE PAD SIZE	BODY THICKNESS	JEDEC SPEC	PART NUMBER
.650 sq	44	0.050	0.230 sq	0.150	MS-018	PLCC4423001
.650 sq	44*	0.050	0.340 sq	0.150	MS-018	PLCC4430001
.950 sq	68	0.050	0.325 sq	0.150	MS-018	PLCC6832501
.950 sq	68*	0.050	0.410 sq	0.150	MS-018	PLCC6841001

* Call for availability

Contact us today for detailed information including technical specs, drawings, and part photos.

Next day delivery with no lot charges or expedite premiums!

Custom lead frames and package designs are available –
please contact us to discuss your requirement.

Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274