Pre-molded PLCC Package

Global Chip Materials manufactures open cavity PLCC packages in two popular lead counts — 44 and 68. Pre-molded Plastic Leaded Chip Carriers are an ideal, cost-effective solution for quick turn test and prototyping of new IC designs. Open Cavity packages are also ideal for applications such as vision packaging and MEMs. Pre-molded PLCC packages are a lower cost alternative to more expensive ceramic leaded chip carriers. The gold plated lead frame features J-shaped leads that tuck under the package body. Pad sizes are available to accommodate larger die. These packages have JEDEC compliant outlines and can be used with standard PLCC test sockets. They can be easily sealed using epoxy-coated lids or glob top.

 


 

More Info On Pre-molded Packages

PLCC Package Configuration Options (Dimensions in inches)
BODY
SIZE
LEAD
COUNT
LEAD
PITCH
DIE PAD
SIZE
BODY
THICKNESS
JEDEC
SPEC
PART
NUMBER
REQUEST
QUOTE
.650 sq 44 0.050 0.230 sq 0.150 MS-018 PLCC4423001 Quote
.650 sq 44* 0.050 0.340 sq 0.150 MS-018 PLCC4430001 Quote
.950 sq 68 0.050 0.325 sq 0.150 MS-018 PLCC6832501 Quote
.950 sq 68* 0.050 0.410 sq 0.150 MS-018 PLCC6841001 Quote

* Call for availability

Contact us today for detailed information including technical specs, drawings, and part photos.

Next day delivery with no lot charges or expedite premiums!

Custom lead frames and package designs are available –
please contact us to discuss your requirement.



Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274


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