Open Cavity QFN Package

Global Chip Materials manufactures premolded open cavity QFN packages in standard JEDEC body sizes and lead counts. The Quad Flat No-Lead (QFN) package is a leadless near-chip-scale package (CSP) that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. The QFN features an exposed die pad on the backside that allows for efficient heat dissipation and high power capability. It also features perimeter lands rather than external leads, which enhances electrical performance.

Premolded Cavity QFN /MLP Package Features:
	JEDEC Standard MS-220 body sizes and lead counts
	Compact size, high performance
	Gold-plated copper leadframe
	Premolded for superior performance and reliability when compared to “reworked” packages
	Compatible with standard assembly processes
	Cost-effiective solution for quick-turn test and prototyping

QFN Package Configuration Options (Dimensions in millimeters )

PACKAGE TYPE	LEAD COUNT	BODY SIZE	DIE PAD SIZE	LEAD PITCH	BODY THICKNESS	PART NUMBER
QFN	28	5 x 5	3.30 sq	0.50	0.80	QFN5X5-2801
QFN	32	5 x 5	3.30 sq	0.50	0.80	QFN5X5-3201
QFN	44	7 x 7	4.60 sq	0.50	0.80	QFN7X7-4401
QFN	48	7 x 7	4.60 sq	0.50	0.80	QFN7X7-4801
QFN	52	8 x 8	5.28 sq	0.50	0.80	QFN8X8-5201
QFN	56	8 x 8	5.28 sq	0.50	0.80	QFN8X8-5601
QFN	64	9 x 9	5.95 sq	0.50	0.80	QFN9X9-6401

Custom molding, lead frame and package design services are available –
please contact us to discuss your requirement.

Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274