Open Cavity QFN Package

Global Chip Materials manufactures premolded open cavity QFN packages in standard JEDEC body sizes and lead counts. The Quad Flat No-Lead (QFN) package is a leadless near-chip-scale package (CSP) that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. The QFN features an exposed die pad on the backside that allows for efficient heat dissipation and high power capability. It also features perimeter lands rather than external leads, which enhances electrical performance.

 

   
Premolded Cavity QFN /MLP Package Features:
JEDEC Standard MS-220 body sizes and lead counts
Compact size, high performance
Gold-plated copper leadframe
Premolded for superior performance and reliability when compared to “reworked” packages
Compatible with standard assembly processes
Cost-effiective solution for quick-turn test and prototyping
   
QFN Package Configuration Options (Dimensions in millimeters )
PACKAGE
TYPE
LEAD
COUNT
BODY
SIZE
DIE PAD
SIZE
LEAD
PITCH
BODY
THICKNESS
PART
NUMBER
REQUEST
QUOTE
QFN 28 5 x 5 3.30 sq 0.50 0.80 QFN5X5-2801 Quote
QFN 32 5 x 5 3.30 sq 0.50 0.80 QFN5X5-3201 Quote
QFN 44 7 x 7 4.60 sq 0.50 0.80 QFN7X7-4401 Quote
QFN 48 7 x 7 4.60 sq 0.50 0.80 QFN7X7-4801 Quote
QFN 52 8 x 8 5.28 sq 0.50 0.80 QFN8X8-5201 Quote
QFN 56 8 x 8 5.28 sq 0.50 0.80 QFN8X8-5601 Quote
QFN 64 9 x 9 5.95 sq 0.50 0.80 QFN9X9-6401 Quote


Contact us today for detailed information including technical specs, drawings, and part photos.

Custom molding, lead frame and package design services are available –
please contact us to discuss your requirement.




Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274


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