Pre-molded Open Cavity LQFP Package

Global Chip Materials manufactures plastic open cavity LQFP packages in a variety of configurations. Our plastic QFP family of IC packages is a cost-effective alternative to more expensive ceramic QFP’s. These plastic quad flat packages meet JEDEC standard outlines and footprints and have a body thickness less than 1.2 mm. The higher lead count packages are available with tie-bars in place to eliminate coplanarity issues. All of our pre-molded open cavity IC packages are gold plated to insure reliable wire bonds, robust die adhesion and extended shelf life. Pre-molded LQFP / TQFP packages are an ideal, cost-effective solution for quick turn test and prototyping. They can be easily sealed using epoxy-coated lids or glob top.

More Info On Pre-molded Packages

TQFP / LQFP Configuration Options (Dimensions in millimeters)

BODY SIZE	LEAD COUNT	BODY THICKNESS	LEAD PITCH	DIE PAD SIZE	PART NUMBER
7 x 7	32	1.19	0.80	3.95 sq	LQFP07-3201
7 x 7	48	1.19	0.50	3.95 sq	LQFP07-4801
10 x 10	44	1.14	0.80	6.86 sq	LQFP10-4401
10 x 10	52	1.14	0.65	6.86 sq	LQFP10-5201
10 x 10	64	1.14	0.50	6.86 sq	LQFP10-6401
14 x 14*	80	1.19	0.65
14 x 14*	100	1.19	0.50
28 x 28*	160	1.19	0.65
28 x 28*	208	1.19	0.50

* Denotes current technology roadmap

Contact us today for detailed information including technical specs, drawings, and part photos.

Next day delivery with no lot charges or expedite premiums!

Custom lead frames and package designs are available –
please contact us to discuss your requirement.

Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274