Open Cavity Plastic SOIC Package

Global Chip Materials manufactures a variety of Small Outline IC packages in plastic open cavity configurations. An ideal quick-turn assembly solution, these surface mount packages replicate the footprint and performance of their production counterparts. They feature gold plated die pad, bond fingers, and external leads. These packages have gull-wing formed leads and are available in body widths of 150 and 300 mils. Some configurations are available with E-Pads for increased heat dissipation in high frequency applications.

More Info On Pre-molded Packages

SOP / SOIC / SSOP Configuration Options (Dimensions in inches)

BODY WIDTH	LEAD COUNT	LEAD PITCH	DIE PAD SIZE	BODY THICKNESS	JEDEC SPEC	PART NUMBER
.150	8	.050	.075 x .100	.055	MS-012	SO08071001
.150	8	.050	.085 x .120	.055	MS-012	SO08081201
.150	14	.050	.075 x .100	.055	MS-012	SO14071101
.150	16	.025	.075 x .100	.055	M0-137	SSOP16071001
.150	16	.050	.075 x .120	.055	MS-012	SO16071201
.300	16	.050	.150 x .220	.093	MS-013	SO16152201
.300	20	.050	.150 x .220	.093	MS-013	SO20152201
.300	24	.050	.150 x .220	.093	MS-013	SO24152201
.300	28	.050	.160 x .230	.093	MS-013	SO28162301

Contact us today for detailed information including technical specs, drawings, and part photos!

Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274