Ceramic SOIC

             

The SOIC is an ideal package for telecommunication, automotive, and other applications that require dense placement of chips on boards. It is a surface mount package with .050" lead spacing. Ceramic SOICs are currently only manufactured in 16, 20, 24, and 28 lead configurations.

  • Multilayer Ceramic Package
  • Surface Mount
  • Comparable Foot Print With Wide Body SOP Plastic Packaging
  • Solder, Glass or Epoxy Seal
  • Gull Wing Lead Configuration
  • Gold Plated Leads

Get Acrobat ReaderManufacturer's Specifications
Electrical/Plating Specifications

 
NAME OF
PACKAGE
GCM PART # MFG. PART # CAVITY
SIZE
PHOTO DRWG. LEAD
FORM
BODY SIZE
W x L
THICKNESS
(t1/t2/Total)
BOND
LAY-OUT
COMBO
LID
16 SOIC SO16172801 RFQ REGISTER .170 x .283 JPG PDF Z .293 x .411 .015/025/.085 2 x 6 REGISTER
20 SOIC SO20172801 RFQ REGISTER .170 x .283 JPG PDF Z .293 x .504 .015/.025/.085 4 x 6 REGISTER
24 SOIC SO24172801 RFQ REGISTER .170 x .283 JPG PDF Z .293 x .606 .015/.025/.085 6 x 6 REGISTER
28 SOIC SO28172801 RFQ REGISTER .170 x .283 JPG PDF Z .293 x .706 .015/.025/.085 6 x 8 REGISTER

Copyright 2000-2011 Global Chip Materials, LLC. All rights reserved.